REFLOW SOLDER PASTE DOWNLOAD
3D step files are available for download as well.Įxample of an orientation mark in a Luminus SMD component. Access to these files online will allow designers to incorporate Luminus products into circuit designs without having to spend time creating the library files. Symbols and footprints are available in a wide variety of formats including Altium, Eagle, Pads, OrCAD, and more. Luminus maintains a database of electronic design files in collaboration with SnapEDA. The middle pad is the thermal pad, further discussed in this article. The figure below shows the orientation identification markings for individual components. Further information can be found in the respective product datasheets.Įxample of tape dimensions and device orientation provided in the datasheet. Industry standard “cathode towards the holes” orientation is used. The figure below shows an example of the dimensions of the tape for a Luminus LED component and the orientation of parts within the reel.
REFLOW SOLDER PASTE OFFLINE
If this is not an option, solder paste printing can be completed manually as an offline process. We recommend that manufacturers automate the solder paste printing process by using a pick-and-place machine with an integrated stencil print cell. The reels supplied by Luminus are ready for automated pick and place operations. Luminus recommends you locate the equipment in a controlled environment maintained at a temperature of 23 ± 5C and a relative humidity less than 60%. Do not use acetone or any type of acid.Īpply solder paste to the PCB with a screen or stencil using a thickness range of 0.15mm (0.006”) to 0.25 mm (0.010”). Ultrasonic cleaners or vapor degreasers are not recommended and may damage the device. Cleaning the circuit board is not required, but if desired, isopropyl alcohol and DI water may be used. A properly activated no clean flux leaves some visible residue that have no long-term deleterious effects on reliability.
Luminus recommends using an SAC305 solder paste with a no-clean flux for RoHS compliant products. Below, we provide a set of best practice guidelines. Luminus recommends using the solder paste manufacturer’s’ instructions as a starting point in process development. It is not possible to provide a single solution that covers all applications. Reflow soldering SMD components has a large number of variables: type of solder, particle size and flux, component density and circuit board mass, solder paste printing details, reflow equipment used, to name a few.
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